1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Products description
The TIF®1100-02F Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
Features
>Good thermal conductivity: 1.5W/mK
>Naturally tacky needing no further adhesive coating
>Soft and Compressible for low stress applications
>Available in varies thickness
>High tack surface reduces contact resistance
>RoHS compliant
>UL recognized
Application
>Cooling components to the chassis of frame
>Set Top Box
>Car Battery & Power Supply
>Charging Pile
>LED TV/Lighting
>Graphics Card Thermal Module
>CPU
>Display card
>Mainboard/mother board
>Notebook
>Power supply
>Heat pipe thermal solutions
>Memory Modules
| Typical Properties of TIF®1100-02F Series |
| Color | Gray | Visual |
| Construction | Ceramic filled silicone elastomer | ****** |
| Thickness Range(inch/mm) | 0.020~0.20inch(0.5mm~5.0mm) | ASTM D374 |
| Density(g/cc) | 2.3 g/cc | ASTM D297 |
| Hardness | 60 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature(℃) | -40 to 160℃ | ****** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant @ 1MHz | 4.0 | ASTM D150 |
| Volume Resistivity | ≥1.0X1012Ohm-meter | ASTM D257 |
| Flame rating | 94 V-0 | UL E331100 |
| Thermal conductivity | 1.5W/m-K | ASTM D5470 |
Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
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1.5W/Mk High Performance Thermal Gap Pad Silicone Thermal Pad For Memory Modules Images
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